Saving You Time and Resources

Our mission is to simplify and by extension reduce the overhead for your microelectronic processing efforts. We achieve this through our INTERLITH product line.

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In any kind of manufacturing, efficiency is paramount. Our INTERLITH solution is engineered to reduce process complexity, minimize waste, and lower production costs. Discover how our innovative photometallographic glass technology delivers tangible benefits to your business.

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Featured Products:

• INTERLITH: Our photometallographic spin-on-glass, available for i-line lithography processing. For semiconductor, PCB, microfluidic and other applications requiring fast and waste free metal formation.

 

Process Streamlining:

• One-Step Integration:
  Combine patterning and metal deposition in a single, streamlined step, eliminating additional masking, etching, and cleaning processes.

• Faster Cycle Times:
  Rapid UV curing drastically reduces process time, increasing throughput and shortening time-to-market.

 

Resource Optimization:

• Reduced Chemical Consumption:
  Fewer processing steps lead to lower usage of chemicals and less hazardous waste, reducing both costs and environmental impact.

• Improved Yields:
  High-precision patterning and uniform film formation translate into consistent device performance and fewer production defects.

 

Business Impact:

• Accelerate production schedules

• Lower operational costs and improve profit margins

• Achieve scalability and flexibility in manufacturing processes