INTERLITH - Technical Details

What Does the INTERLITH Process Look Like?

INTERLITH is a fully wet spin on processed material, in where all the actions are performed in an atmospheric environment.

 

In the same way you would process a traditional photoresist, only with INTERLITH there is no development step and the final result is a film with conductive traces where the light has exposed the film.

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Process: Coat → UV exposure (mask defined) → bake to set the glass and seal the metal.
Function: Arbitrary conductive routing inside one monolithic glass sheet, no further development or plating required.
 

Specification Guidance

• Feature sizes: down to 20 microns with contact masks; coarser on projection tools.

• Layering: sequential coat/expose/bake cycles enable multi-layer routing and simple buried vias.

• Thermal budgets:

  • Low-temperature set: ≤ 250 °C (3H silica matrix).

  • High-temperature glass densification: available within the same material.

• Adhesion & durability: metal is sealed inside the glass film; dark regions remain insulating.

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Design & Integration Notes

• Masks: Standard chromium-on-glass or film masks; hard contact improves edge acuity.

• Stacks: Compatible with glass/FR-4 carriers; can be laminated, bonded, or integrated as a utilities layer in interposer stacks.

• Open pads / landings: Keep windows minimal; most routing should remain buried for maximum robustness.

• Current & length: Best for short to moderate runs, sensing, and utility paths. For long, high-current distribution or ultra-low loss, pair with copper technologies.

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Handling, Storage & Safety

• Storage: INTERLITH is a light sensitive compound, store it cool and away from ambient light.

• Handling: INTERLITH contains flammable solvents, store according to local safety regulations.

• Disposal: INTERLITH contains silver metal salts, dispose according to local waste disposal regulations.