INTERLITH - Draw Metal Inside Glass, With Light

INTERLITH photometallographic glass is a liquid precursor material that let's manufacturers draw metal lines inside glass without any additional processing. 

 

Create arbitrary mask defined electrical routing using i-line UV (365 nm) lithography inside a single glass film, no wet etching or plating needed.

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Why INTERLITH?

• True design freedom: Route conductors in any 2D geometry your photomask defines. Stack layers for depth.

• One clean flow: Coat → expose → bake. That’s it. No developers, etchants, or plating lines.

• Sealed for life: Conductors are buried inside glass, resisting humidity, abrasion, and handling.

• Glass native: Ideal for optics, sensors, microfluidics, specialty interposers, and smart glass.

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What You Can Build

• Embedded routing for sensors, micro-heaters, strain/temperature monitors, and fiducials.

• Glass interposer stacks: interconnect, grounds, guards, shields and feedthroughs.

• Microfluidic electrodes under channels and windows.

• Transparent function: hidden busbars, current spreaders, and circuits beneath glass.

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The Practical Stuff

• Mask-defined features: down to fine tens of micrometers (contact lithography).

• Low T set: post-bake below 250 °C (3H silica), or higher-temp glass densification where lines allow.

• Durability: metal sealed in glass → stable under common thermal/humidity regimes.

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What You Can Leave Out

• No Sputter Deposition

• No Plating

• No Wet Etching

• No Lift Off Processing