INTERLITH - Product Overview

INTERLITH is a photo-patternable metallization glass. You apply a thin liquid film, shine (365 nm) UV light through a mask, and then bake. Metal forms only in the exposed regions and becomes sealed inside the glass after baking, leaving the dark (unexposed) regions insulating.

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Result: arbitrary, mask-defined conductive routing embedded in one monolithic glass film.

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Why Teams Choose INTERLITH​

• Simpler manufacturing: Replace resist spin, expose, develop, strip, sputter/etch, and plating with a single chemistry and two basic steps.

• Higher reliability: Encapsulated conductors are shielded from the environment.

• Design agility: Iterate masks quickly; stack multiple coated layers for 3D routing.

• Glass-friendly: Works on common technical glasses and ceramics.

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Where INTERLITH Shines

• Microfluidics & lab-on-glass: buried electrodes/heaters under channels, optical windows untouched.

• Interposer “utilities” for chiplet systems: ground/guard rings, shields, heaters, sensor nets, fiducials, coarse feedthroughs.

• Optics & smart devices: hidden busbars, current spreaders, aesthetic circuits under glass.

• Specialty sensing: strain/temperature patterns sealed beneath the surface.

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For high current PDNs or ultra-fine redistribution layers, traditional copper processes still apply. INTERLITH complements them with embedded utilities and rapid prototyping.